Innovations for military and other high industrial reliability markets.

Raytheon Systems Ltd. (RSL), formerly Hughes Electronics Systems Ltd (a Hughes UK company) has been based in Glenrothes, Scotland for 37 years and maintains a unique UK position by providing electronics manu facturing capabilities at component, sub system and module level.
RSL offers a complete, integrated electronics design and manufacturing capability with demonstrated experience across those applications that demand rigorous performance qualifications including military, space, aerospace, transportation, oil and gas exploration and medical and industrial sectors. RSL has particular strengths in hybrid electronics and has developed many innovations for military and other demanding applications.

Operations range from semiconductor and ASIC fabrication to complex sub-system assembly and provide design capability for new custom designs and manufacture of in-house and customer solutions. Manufacturing is fully supported by engineering and test development (including electronic, environmental and application specific testing) to minimise manufacturing costs and validate designs. RSL meets the demand from customers seeking to work with one supplier rather than sourcing from several.
RSL produces sub-systems for AMRMM, Tomahawk, Starstreak, Boeing (McDonnell-Douglas) Space Station, the HS-601 family of Hughes satellites, Challenger-II, ground-based tactical radios, Longbow Hellfire missiles, Hellfire II and Warrior.
RSL also provides extensive capabilities in hybrid and multi-chip module (MCM) design and packaging technology.Instead of traditional hybrid packaging, in some applications the systems electronic division of RSL utilises polymeric encapsulation technology (Glob Top) in white plastic-resin material to protect the semi-conductor die. If strict hermeticity is not required, plastic-encapsulated power-packaging techniques may be considered. Offering reduced size, low weight and high reliability over a wide temperature range, Glob Top is used in several military applications. Although construction is not hermetic, RSL's processes are approved to European Military Standard CECC63000.

Compactness of hybrid construction is also advantageous in power electronics. Traditional packaging for power hybrids used in military applications comprises a metal package with round leads mounted in glass seals at the ringframe. At currents greater than 50amps the package lead diameter and the large diameter of glass-to-metal seals makes seals liable to crack. RSL has developed an alternative power-packing technology that replaces glass-to-metal seals with direct-bonded copper (DBC) packaging. The DBC substrates are formed by eutectically bonding alternate layers of copper and ceramic. The method of construction allows fully hermetic packages to be built where the DBC substrates acts as the package base.
Raytheon Systems Ltd.' manufacturing capability is underpinned by continuous measurable improvement (CMI) that ensures a flexible yet structured approach to improvements in quality, cost and customer service.